Trusted Semiconductor Die/Wafer Source

DPACI is a Trusted Source accredited by DMEA.

Because of DPACI’s unique position of being both a customer of and a supplier of services to several major memory manufacturers; we are a source to provide a Turn-Key Solution to your high density memory requirements.​

Die wafer machine

To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.

A man holding a die wafer

One more advantage of using DPACI as your die/wafer source is the ability to obtain die or elemental evaluation certification in accordance with MIL-PRF-38534 directly with one order. Elemental Evaluation in accordance with Table C-II of MIL-PRF-38534 is performed to certify the wafer lot to be Class H or Class K compliance in accordance with MIL-PRF-38534 for the use in hybrids and multichip modules. Our standard die evaluation for H and K certification is as follows:

  1. Sample selection per  MIL-STD-883, Method 2018
  2. Package and prepare die in accordance with MIL-PRF-38534,
    paragraph C.3.3.3.2
  3. Perform die evaluation per MIL-PRF-38534 paragraph C.3.3.6.6, Table C-II for Class H or Class K as applicable.
  4. Test report with read and record data of die evaluation.
  5. Certification of wafer traceability lot to Class H or Class K requirements.
We perform all die preparation, sample assembly, evaluation and test per Table C-II in-house with full traceability and MIL-STD-883 DLA Laboratory Certification.
Allow DPACI to provide a Turn-Key Solution to your custom hybrid or MCM needs.